Qualcomm has announced its latest innovation: the Snapdragon X Plus chip. Designed specifically for Windows-based laptops, this Arm-based chip aims to revolutionize the industry with its superior performance and power efficiency, positioning itself as an AI powerhouse.

The Snapdragon X Plus chip boasts a 10-core CPU, onboard GPU, and Qualcomm’s Hexagon neural processing unit (NPU). Equipped with up to 64GB of memory, this chip is optimized to deliver exceptional multitasking capabilities and ample storage for demanding tasks.

What sets the Snapdragon X Plus chip apart is its AI capabilities. Qualcomm claims that it offers the world’s fastest NPU for laptops, enabling enhanced performance while running local generative AI applications. Unlike traditional AI applications that rely on data centers accessed through the web, the Snapdragon X Plus chip allows users to harness the power of AI without an internet connection. This breakthrough feature ensures that data remains secure and accessible even when offline.

Moreover, Qualcomm’s chip is positioned to compete against Intel’s latest Core Ultra line and Apple’s M3 chips. The Snapdragon X Plus chip not only provides better performance per watt but also consumes less power than its rivals, according to Qualcomm’s claims. This makes it an attractive choice for users seeking both high performance and energy efficiency.

While the Snapdragon X Plus chip is expected to become available in mid-2024, it represents Qualcomm’s latest foray into the Windows PC market. Historically, the company faced challenges in gaining traction due to compatibility issues with x86-based apps running on Intel and AMD chips. However, as more developers adapt their applications to run on Arm-based platforms, Qualcomm’s chips are becoming a more viable option for consumers and enterprise users.

The success of the Snapdragon X Plus chip will depend on real-world performance, which is yet to be fully evaluated. Benchmarks indicate promising results, but it remains to be seen how the chip will fare against competitors like Intel, AMD, and Apple. If Qualcomm’s claims hold true, the PC market could experience significant disruption, as users seek out the enhanced capabilities of the Snapdragon X Plus chip.

As technology enthusiasts eagerly await the release of Qualcomm’s Snapdragon X Plus chip, industry experts predict that this development will intensify the competition in the PC market. Intel and AMD, in particular, will face a formidable challenger in Qualcomm, with the potential to reshape the landscape of Windows-based laptops.

For the latest updates on the Snapdragon X Plus chip and its impact on the PC market, stay tuned to reputable technology news sources and Qualcomm’s official announcements. The race for PC dominance is heating up, and the Snapdragon X Plus chip aims to be at the forefront of this revolution.


  • Best-in-class CPU with high performance and remarkable power efficiency
  • Delivers exceptional energy savings and up to multiple days of battery life*
  • Industry-leading Qualcomm® AI Engine, with up to 45 TOPS AI performance
  • Best-in-class processing across CPU, GPU, NPU, and Micro NPU
    • Qualcomm Oryon CPU
    • Adreno GPU
    • Hexagon NPU
    • Qualcomm Sensing Hub
  • On-device AI for transformative intelligent experiences, including support for Generative AI at 30 tokens per second
  • Premium integrated GPU delivers dazzling graphics performance
  • Lightning-fast downloading, streaming, and syncing of files with 5G and Wi-Fi 7 connectivity, including HBS Multi-Link for minimized latency and jitter-free entertainment
  • Enterprise-grade security for enhanced protection from chip to cloud
  • Support for AV1 encode and decode for up to 4K HDR video streaming
  • Immersive, lossless audio for high-fidelity music and entertainment with your wireless headphones with Snapdragon Sound Technology Suite
  • Support for up to three external UHD monitors running at 60 Hz, delivering snappier and smoother display experiences
  • LPDDR5x memory with 135 GB/s bandwidth for faster AI experiences and efficient multitasking
  • Advanced MIPI camera support for high-quality imaging and intelligent features, such as auto-framing, background blur, and facial authentication at lower power consumption



Name: Qualcomm® Oryon™

Number of Cores: 10

Architecture: 64-bit

Clock Speed: Up to 3.4 GHz


Name: Qualcomm® Adreno™

Tera Floating Point Operations Per Second: Up to 3.8 TFLOPS

APIs: DirectX® 12


Name: Qualcomm® Hexagon™

Tera Operations Per Second: Up to 45 TOPS


Type: LPDDR5x

Bit Width: 16-bit

Number of Channels: 8

Transfer Rate: 8448 MT/s

Bandwidth: 135 GB/s

Capacity: Up to 64 GB


SD: SD 3.0

SSD/NVMe Interface: NVMe, over PCIe 4.0

UFS: UFS 4.0

Process Node and Technology

Process Node: 4 nm


Display Processing Unit (DPU) Name: Qualcomm® Adreno™

Maximum On-Device Display Resolution: 4K Ultra HD @ 120 Hz

Maximum External Display Resolution: 4K @ 60 Hz

High Dynamic Range (HDR): HDR10

Number of Concurrent Displays: 31

Interface Type: DisplayPort 1.42


Video Processing Unit (VPU) Name: Qualcomm® Adreno™ VPU

Encoding Resolution: 4K @ 60 Hz

Encoding Bit Depth: 10-bit

Encoding Formats: H.264 (Advanced Video Coding (AVC)), AV1, H.265 (High Efficiency Video Coding (HEVC))

Decoding Resolution: 4K @ 120 Hz

Decoding Bit Depth: 10-bit

Decoding Formats: H.264 (Advanced Video Coding (AVC)), VP9, AV1, H.265 (High Efficiency Video Coding (HEVC))

Concurrency: Decode: 4K @ 60 Hz / Encode: 2x 4K @ 30 Hz


Image Signal Processor (ISP) Name: Qualcomm® Spectra™

Image Signal Processor (ISP) Number: Dual ISP

Image Signal Processor (ISP) Bit Depth: 18-bit

Dual Camera: 36+36 MP

Single Camera: Up to 64 MP

Video Capture: 4K

Video Capture Formats: H.264 (Advanced Video Coding (AVC)), H.265 (High Efficiency Video Coding (HEVC))

Video Capture Features: High Dynamic Range (HDR)


Qualcomm Aqstic™ technology support: Qualcomm Aqstic™ audio technology

Qualcomm® aptX™ audio technology support: Qualcomm® aptX™ Audio

Cellular Modem-RF

Modem Name: Snapdragon™ X65 5G Modem-RF System

Peak Download Speed: 10 Gbps

Peak Upload Speed: 3.5 Gbps

Cellular Modem-RF Specs: 300 MHz bandwidth (sub-6 GHz), 1000 MHz bandwidth (mmWave)

Performance Enhancement Technologies: Qualcomm® AI-Enhanced Signal Boost adaptive antenna tuning, Qualcomm® Smart Transmit™ technology, Qualcomm® 5G PowerSave, Qualcomm® Wideband Envelope Tracking

Cellular Technology: 5G NR, HSPA, sub-6 GHz, Dynamic Spectrum Sharing (DSS), LTE, WCDMA, CBRS, mmWave


Wi-Fi/Bluetooth System: Qualcomm® FastConnect™ 7800

Generation: Wi-Fi 6, Wi-Fi 6E, Wi-Fi 7

Standards: 802.11b, 802.11g, 802.11n, 802.11ac, 802.11a, 802.11ax, 802.11be

Spectral Bands: 6 GHz, 5 GHz, 2.4 GHz

Spatial Streams: Up to 4

Peak QAM: 4K QAM

Features: Multi-Link Operation (MLO), Passpoint, TDLS, OFDMA (UL/DL), Wi-Fi QoS Management, MU-MIMO (UL/DL), Wi-Fi Optimized Connectivity, Wi-Fi Location, Miracast, Voice-Enterprise, High-band Simultaneous (HBS), 8×8 Sounding, Target Wake Time


Specification Version: Bluetooth® 5.4

Connection Technology: Bluetooth® Low Energy

Universal Serial Bus (USB)

Interface Type: 3x USB-C

Specification Version: USB43


Platform Extensions: 5G4Wi-Fi4

Leave a Reply

Your email address will not be published. Required fields are marked *